Thermally conductive silicone potting is a two-component silicone adhesive as the basic raw material. A certain proportion of heat-resistant and flame-retardant additives are added to cure to form a thermally conductive encapsulant, which can be reliable for a long time within a wide range of temperature and humidity changes. It protects sensitive circuits and components, and has certain characteristics such as shock resistance, drop resistance and dust resistance.
Product Description
Potting adhesive is a synthetic compound, which is widely used in various electronic and computer internal memory components, etc. Playing a role in preventing moisture, dust, corrosion, and shock. FUTUREWAY®Thermally conductive silicone potting is a two-component and low-density silicone product. It is in a liquid state before potting, and it will solidify for a certain period of time after potting to form a stable state, which can effectively exert shock resistance , moisture-proof and dust-proof effect.
Product Features and Advantages
• Simple and convenient operation
• Excellent electrical insulation properties
• During the curing process, there is no heat release and no solvent or curing by-products. It is repairable and can be deeply cured into an elastomer.
Product Applications
Used as insulation and thermal conductivity potting for products such as electronics, power modules, high-frequency transformers, connectors, sensors, electric heating parts and circuit boards.
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